FORUM ON IC PACKAGING PANELS

被引：0
|
作者：
BALDE, J
BEST, D
FREEHAUF, G
GRUBB, D
HUNTER, R
KOPPEL, H
LEARY, B
LEE, R
LOMBARDI, E
MAZZEO, R
MCGARVEY, T
MESSNER, G
PAHUTSKI, L
PEEL, M
PENLAND, F
SAHELEY, C
SCHMIDT, R
WHITEHEAD, R
WILLMINGTON, G
机构：
[1] HUGHES AIRCRAFT CO,DESIGN SUPPORT GRP,CULVER CITY,CA 90230
[2] SCANBE,EL MONTE,CA 91731
[3] AUGAT INC,ATTLEBORO,MA
[4] GARRY MFG CO,NEW BRUNSWICK,NJ 08902
[5] TEXAS INSTRUMENTS INC,DALLAS,TX 75222
[6] DIGITAL EQUIPMENT CORP,MAYNARD,MA 01754
[7] GARDNER DENVER CO,GRAND HAVEN,MI 49417
[8] MOORE SYST,SUNNYVALE,CA
[9] INT TEL & TELEG,NEW YORK,NY
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1979年 / 21卷 / 09期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：27 / 36
页数：10
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