FORUM ON IC PACKAGING PANELS

被引：0
|
作者：
BALDE, J
BEST, D
FREEHAUF, G
GRUBB, D
HUNTER, R
KOPPEL, H
LEARY, B
LEE, R
LOMBARDI, E
MAZZEO, R
MCGARVEY, T
MESSNER, G
PAHUTSKI, L
PEEL, M
PENLAND, F
SAHELEY, C
SCHMIDT, R
WHITEHEAD, R
WILLMINGTON, G
机构：
[1] HUGHES AIRCRAFT CO,DESIGN SUPPORT GRP,CULVER CITY,CA 90230
[2] SCANBE,EL MONTE,CA 91731
[3] AUGAT INC,ATTLEBORO,MA
[4] GARRY MFG CO,NEW BRUNSWICK,NJ 08902
[5] TEXAS INSTRUMENTS INC,DALLAS,TX 75222
[6] DIGITAL EQUIPMENT CORP,MAYNARD,MA 01754
[7] GARDNER DENVER CO,GRAND HAVEN,MI 49417
[8] MOORE SYST,SUNNYVALE,CA
[9] INT TEL & TELEG,NEW YORK,NY
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1979年 / 21卷 / 09期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：27 / 36
页数：10
相关论文
共 50 条
  • [31] Lasers in advanced IC packaging applications
    Konidaris, Nick
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 396 - 399
  • [32] Trends in IC packaging and advanced assembly
    Electron Packag Prod, 8 (26):
  • [33] Advanced IC packaging for the future applications
    Anjoh, I
    Nishimura, A
    Eguchi, S
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (03) : 743 - 752
  • [34] Microsystem packaging: lessons from conventional low cost IC packaging
    Kelly, G
    Alderman, J
    Lyden, C
    Barrett, J
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1997, 7 (03) : 99 - 103
  • [35] Forum: Roland 500 serves the packaging industry
    Delfosse, Martine
    Revue du Papier Carton, 2002, (58): : 42 - 43
  • [36] Roland's Technology Forum for packaging printers
    Anon
    2002, Brunton Business Publications (29):
  • [37] VACUUM INSULATED PANELS (VIP) IN INSULATED PACKAGING
    Kacimi, A.
    Labranque, G.
    23RD IIR INTERNATIONAL CONGRESS OF REFRIGERATION, 2011, 23 : 681 - 688
  • [38] Inverse damage detection in IC packaging component
    Wu, Chun-Yin
    Lin, Wen-Chang
    13TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, PROCEEDINGS, 2007, : 214 - 214
  • [39] Characterisation of IC packaging interfaces and loading effects
    Yeo, H. C.
    Guo, N.
    Du, H.
    Huang, W. M.
    Jian, X. M.
    MICROELECTRONICS RELIABILITY, 2006, 46 (9-11) : 1892 - 1897
  • [40] Ultrasonic weak bond evaluation in IC packaging
    Jian, X.
    Guo, N.
    Dixon, S.
    Grattan, K. T. V.
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2006, 17 (10) : 2637 - 2642
12345