FORUM ON IC PACKAGING PANELS

被引：0

作者：

BALDE, J

BEST, D

FREEHAUF, G

GRUBB, D

HUNTER, R

KOPPEL, H

LEARY, B

LEE, R

LOMBARDI, E

MAZZEO, R

MCGARVEY, T

MESSNER, G

PAHUTSKI, L

PEEL, M

PENLAND, F

SAHELEY, C

SCHMIDT, R

WHITEHEAD, R

WILLMINGTON, G

机构：

[1] HUGHES AIRCRAFT CO,DESIGN SUPPORT GRP,CULVER CITY,CA 90230

[2] SCANBE,EL MONTE,CA 91731

[3] AUGAT INC,ATTLEBORO,MA

[4] GARRY MFG CO,NEW BRUNSWICK,NJ 08902

[5] TEXAS INSTRUMENTS INC,DALLAS,TX 75222

[6] DIGITAL EQUIPMENT CORP,MAYNARD,MA 01754

[7] GARDNER DENVER CO,GRAND HAVEN,MI 49417

[8] MOORE SYST,SUNNYVALE,CA

[9] INT TEL & TELEG,NEW YORK,NY

来源：

ELECTRONIC PRODUCTS MAGAZINE | 1979年 / 21卷 / 09期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：27 / 36

页数：10

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