Green Future: IC Packaging Opportunities Abound

被引:0
|
作者
Tong, Ho-Ming [1 ]
机构
[1] ASE Grp, Grp R&D, Kaohsiung, Taiwan
来源
2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC) | 2009年
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves in system-on-chip (SoC) and system-in-a-package (SiP), respectively, are being used more in combination to meet the ever-more-stringent cost and time-to-market requirements of consumer products with more functions built in them. In this presentation, I will review the challenges and opportunities to IC packaging as a direct outcome of the above trends to ensure SoC and SiP based IC packages meet the needs of the present generation without compromising the ability of future generations.
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页码:1 / 4
页数:4
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