Microstructure, hardness, and shear behavior of Sn3.0Ag0.5Cu?Sn58Bi composite solder joint

被引：7

作者：

Liu, Yang ^{[1
]}

Liu, Li ^{[1
]}

Xu, Ruisheng ^{[1
]}

Sun, Fenglian ^{[1
]}

Zhu, Dongdong ^{[2
]}

Xu, Haitao ^{[2
]}

机构：

[1] Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Heilongjiang, Peoples R China

[2] Quzhou Univ, Key Lab Air Driven Equipment Technol Zhejiang Pro, Quzhou, Peoples R China

来源：

MATERIALS RESEARCH EXPRESS | 2019年 / 6卷 / 11期

基金：

中国国家自然科学基金;

关键词：

SnAgCu; SnBi; microstructure; hardness; shear behavior; MECHANICAL-PROPERTIES; RELIABILITY; EVOLUTION;

D O I：

10.1088/2053-1591/ab508e

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, Sn3.0Ag0.5Cu-Sn58Bi (SAC-SnBi) composite solder joint was obtained by two-step soldering process. The microstructure, hardness, and shear performance of the composite solder joint were investigated in comparison with the eutectic Sn58Bi (SnBi) and SnAgCu (SAC) solder joints. Experimental results showed that the SAC-SnBi had similar intermetallic compound (IMC) morphology and thickness with the SAC solder joints. Compared with the eutectic SnBi solder, the large Bi-rich matrix transforms into tiny Bi-rich grains in the SAC-SnBi solder bulk. Tiny Bi-rich grains, Cu6Sn5, and Ag3Sn distribute uniformly in the composite solder bulk. As the SnBi bulk melts into the SAC solder during the second soldering process, the formation and growth of large ?-Sn dendritic in SAC solder is suppressed in the composite solder. Therefore, the SAC-SnBi composite joint shows higher hardness and shear strength than the other two.

引用

页数：7

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