Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

被引：24
|
作者：
Liu, Wei [1 ]
Tian, Yanhong [1 ]
Wang, Chunqing [1 ]
Wang, Xuelin [1 ]
Liu, Ruiyang [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
来源：
MATERIALS LETTERS | 2012年 / 86卷
基金：
美国国家科学基金会;
关键词：
Interfaces; Intermetallic alloys and compounds; Orientation; Morphology; MOLTEN SN; SUBSTRATE; GROWTH; SUPERSTRUCTURE; ETA-CU6SN5; INTERFACE; EVOLUTION; CU3SN;
D O I：
10.1016/j.matlet.2012.07.016
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Morphologies and grain orientations of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at the interface of Sn3.5Ag0.5Cu lead-free solder alloy and copper substrates were investigated by Electron Backscatter Diffraction (EBSD) technology combined with Scanning Electron Microscopy (SEM). Scalloped Cu6Sn5, Cu6Sn5 planes and six-prism shaped Cu6Sn5 IMCs were observed at the interface after 48 h of soldering at 250 degrees C. Moreover, Cu6Sn5 planes emerged in pairs on top and beside the scalloped Cu6Sn5, and two adjacent Cu6Sn5 planes were with an angle of 120 degrees. Cu3Sn and scalloped Cu6Sn5 IMCs had preferred orientations, and they were Cu6Sn5 (0001)parallel to substrate surface, and Cu3Sn ((1) over bar 00) and (100)parallel to substrate surface. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：157 / 160
页数：4
相关论文
共 50 条
  • [1] Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads
    Tian, Yanhong
    Zhang, Rui
    Hang, Chunjin
    Niu, Lina
    Wang, Chunqing
    MATERIALS CHARACTERIZATION, 2014, 88 : 58 - 68
  • [2] Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
    Linmei Yang
    Z. F. Zhang
    Journal of Electronic Materials, 2015, 44 : 590 - 596
  • [3] Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
    Yang, Linmei
    Zhang, Z. F.
    JOURNAL OF ELECTRONIC MATERIALS, 2015, 44 (01) : 590 - 596
  • [4] Analysis of Cu6Sn5 Grain Orientations in Sn3.0Ag0.5Cu Lead-Free Solder Joints
    Tian, Yanhong
    Niu, Lina
    Wang, Chunqing
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 353 - 356
  • [5] Size distribution and growth mechanism of interfacial intermetallic compounds in Sn3.0Ag0.5Cu/Cu reflow solder joints
    Yang L.
    Mu G.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2022, 43 (04): : 61 - 67
  • [6] Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints
    Yang, Linmei
    Quan, Shanyu
    Liu, Cong
    Xiong, Hao
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2020, 20 (04) : 2573 - 2577
  • [7] Microstructure growth and tensile strength of Cu/Sn3.0Ag0.5Cu/Cu solder joints
    Yang, Linmei
    Quan, Shanyu
    Shi, Guimei
    MATERIALS RESEARCH EXPRESS, 2019, 6 (01)
  • [8] The properties of intermetallic compounds at Sn3.0Ag0.5Cu/Cu joint interface
    Shu, X.-F., 1600, Journal of Functional Materials, P.O. Box 1512, Chongqing, 630700, China (44):
  • [9] Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints
    Lv, Ziwen
    Wang, Jintao
    Wang, Fengyi
    Wang, Jianqiang
    Li, Fuquan
    Chen, Hongtao
    MATERIALS LETTERS, 2024, 355
  • [10] Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints
    Jiang, Yiming
    Li, Hailong
    Chen, Gang
    Mei, Yunhui
    Wang, Meiyu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (06) : 6224 - 6233
12345