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- [22] The study of phase-angle and transmission specifications of 6% att-EAPSM for 90nm, 65nm and 45nm node wafer manufacturing patterning process PHOTOMASK TECHNOLOGY 2007, PTS 1-3, 2007, 6730
- [23] Resolution enhancement technology requirements for 65nm node DESIGN AND PROCESS INTEGRATION FOR MICROELECTRONIC MANUFACTURING, 2003, : 305 - 313
- [24] Critical doping requirements for ≤65nm device manufacturing MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2004, 114 : 72 - 76
- [25] The challenges of image placement and overlay at the 90nm and 65nm nodes METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVII, PTS 1 AND 2, 2003, 5038 : 286 - 292
- [26] The challenges of image placement and overlay at the 90nm and 65nm nodes Proc SPIE Int Soc Opt Eng, 1600, (286-292):
- [27] Yield loss in lithographic patterning at the 65nm node and beyond DATA ANALYSIS AND MODELING FOR PROCESS CONTROL, 2004, 5378 : 204 - 214
- [28] Progressive ArF exposure tool for the 65nm node lithography Optical Microlithography XVIII, Pts 1-3, 2005, 5754 : 725 - 733
- [29] EBDW technology for EB shuttle at 65nm node and beyond EMERGING LITHOGRAPHIC TECHNOLOGIES XII, PTS 1 AND 2, 2008, 6921
- [30] The impact of mask topography on binary reticles at the 65nm node Optical Microlithography XVIII, Pts 1-3, 2005, 5754 : 527 - 536