Some issues for microsystem packaging in plastic and 3D

被引：2
|
作者：
Morrissey, A
Kelly, G
Alderman, J
Barrett, J
Lyden, C
O'Rourke, L
机构：
[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland
[2] European Space Technol Ctr, European Space Agcy, NL-2200 AG Noordwijk, Netherlands
来源：
MICROELECTRONICS JOURNAL | 1998年 / 29卷 / 09期
关键词：
microsystem packaging; plastic; 3D; residual stress;
D O I：
10.1016/S0026-2692(98)00029-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：645 / 650
页数：6
相关论文
共 50 条
  • [31] Abrasive Erosion Behavior of Some Plastic Parts Obtained by 3D Printing
    Hrituc, Adelina
    Slatineanu, Laurentiu
    Boca, Marius Andrei
    Sover, Alexandru
    Nagit, Gheorghe
    Dodun, Oana
    Coteata, Margareta
    Mihalache, Andrei
    MACROMOLECULAR SYMPOSIA, 2021, 396 (01)
  • [32] Microsystem surveying three dimensional (3D) culture and embryo development
    Shiku, H.
    Nashimoto, Y.
    Torisawa, Y.
    Yasukawa, T.
    Saito, T.
    Ito-Sasaki, T.
    Yokoo, M.
    Abe, H.
    Matsue, T.
    Progress on Post-Genome Technologies, 2006, : 221 - 223
  • [33] Assembly of 3D Probe Array for Wireless Implantable Neuroprobe Microsystem
    Yu Aibin
    Cheng Ming-Yuan
    Tan Kwanling
    Yu Daquan
    Giao, Teh Poh
    Murthy, Ramana B.
    Minkyu, Je
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 721 - 725
  • [34] Research on heat dissipation of RF microsystem 3D packaging based on gold stud bumps and Au-Sn eutectic welding
    Zhao, Yongzhi
    Zhang, Lixiang
    Ji, Naiyi
    Li, Zhiqiang
    Wu, Hongjiang
    Ma, Kaixue
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [35] 3D immunolocalization with plastic sections
    Morphew, Mary K.
    CELLULAR ELECTRON MICROSCOPY, 2007, 79 : 493 - 513
  • [36] Packaging Materials for 2.5/3D Technology
    Schmaltz, Brian
    2013 IEEE INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS (APM), 2013,
  • [37] 3D Packaging and Supply Chain Management
    Collander, Paul
    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 286 - 289
  • [38] Packaging for 3D Optoelectronic stacked processors
    Marchand, PJ
    Zheng, XZ
    Huang, DW
    Ozguz, V
    Esener, S
    OPTOELETRONIC INTEGRATED CIRCUITS AND PACKAGING III, 1999, 3631 : 142 - 147
  • [39] Semiconductor packaging technology for 3D assembly
    Takahashi, Tomoko, 1600, Japan Institute of Electronics Packaging (17):
  • [40] Electroplating Copper Filling for 3D Packaging
    Nagai, Mizuki
    Tamari, Yusuke
    Saito, Nobutoshi
    Kuriyama, Fumio
    Fukunaga, Akira
    Owatari, Akira
    Shimoyama, Masashi
    Moore, Catherine
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 648 - +
12345