Some issues for microsystem packaging in plastic and 3D

被引：2
|
作者：
Morrissey, A
Kelly, G
Alderman, J
Barrett, J
Lyden, C
O'Rourke, L
机构：
[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland
[2] European Space Technol Ctr, European Space Agcy, NL-2200 AG Noordwijk, Netherlands
来源：
MICROELECTRONICS JOURNAL | 1998年 / 29卷 / 09期
关键词：
microsystem packaging; plastic; 3D; residual stress;
D O I：
10.1016/S0026-2692(98)00029-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：645 / 650
页数：6
相关论文
共 50 条
  • [41] Bioinspired approach for 3D packaging problem
    Kureichik, Vladimir
    Glushchenko, Alexander
    Kureichik, Vladimir, Jr.
    Orlov, Anton
    2016 IEEE 10TH INTERNATIONAL CONFERENCE ON APPLICATION OF INFORMATION AND COMMUNICATION TECHNOLOGIES (AICT), 2016, : 387 - 389
  • [42] Microstructural Considerations on the Reliability of 3D Packaging
    Huang, Zhiheng
    Wu, Zhiyong
    Xiong, Hua
    Ma, Yucheng
    ISTFA 2012: CONFERENCE PROCEEDINGS FROM THE 38TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2012, : 44 - 49
  • [43] 3D packaging solutions for a silicon micropump
    Kelly, G
    Alderman, J
    Lyden, C
    Barrett, J
    Morrissey, A
    Val, A
    Sbiaa, Z
    Camon, H
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 1227 - 1234
  • [44] Wafer level interconnects for 3D packaging
    Banerjee, SR
    Drayton, RF
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1513 - 1518
  • [45] Execution of Plastic Parts Using 3D Scanners and 3D Printers
    Bucuresteanu, Anca
    Prodan, Dan
    Motomancea, Adrian
    MATERIALE PLASTICE, 2018, 55 (02) : 215 - 218
  • [46] Some key issues in microelectronic packaging
    Clatterbaugh, GV
    Vichot, P
    Charles, HK
    JOHNS HOPKINS APL TECHNICAL DIGEST, 1999, 20 (01): : 34 - 49
  • [47] A planar compound eye based microsystem for high precision 3D perception
    Zhang, Li
    Zhan, Haiyang
    Liu, Xinyuan
    Cao, Hongjing
    Xing, Fei
    You, Zheng
    PHOTONIX, 2024, 5 (01)
  • [48] NMR microsystem for label-free characterization of 3D nanoliter microtissues
    Marco Grisi
    Gaurasundar M. Conley
    Kyle J. Rodriguez
    Erika Riva
    Lukas Egli
    Wolfgang Moritz
    Jan Lichtenberg
    Jürgen Brugger
    Giovanni Boero
    Scientific Reports, 10
  • [49] NMR microsystem for label-free characterization of 3D nanoliter microtissues
    Grisi, Marco
    Conley, Gaurasundar M.
    Rodriguez, Kyle J.
    Riva, Erika
    Egli, Lukas
    Moritz, Wolfgang
    Lichtenberg, Jan
    Brugger, Juergen
    Boero, Giovanni
    SCIENTIFIC REPORTS, 2020, 10 (01)
  • [50] On-going solutions to environmental issues in plastic packaging
    Katsura, T
    Sasaki, H
    PACKAGING TECHNOLOGY AND SCIENCE, 2001, 14 (03) : 87 - 95
12345