Some issues for microsystem packaging in plastic and 3D

被引：2
|
作者：
Morrissey, A
Kelly, G
Alderman, J
Barrett, J
Lyden, C
O'Rourke, L
机构：
[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland
[2] European Space Technol Ctr, European Space Agcy, NL-2200 AG Noordwijk, Netherlands
来源：
MICROELECTRONICS JOURNAL | 1998年 / 29卷 / 09期
关键词：
microsystem packaging; plastic; 3D; residual stress;
D O I：
10.1016/S0026-2692(98)00029-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：645 / 650
页数：6
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