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- [2] Interconnect and thermal-aware floorplanning for 3D microprocessors ISQED 2006: PROCEEDINGS OF THE 7TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, 2006, : 98 - +
- [3] Fixed-outline Thermal-aware 3D Floorplanning 2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010), 2010, : 552 - +
- [4] The Thermal-aware Floorplanning for 3D ICs using carbon nanotube PROCEEDINGS OF THE 2010 IEEE ASIA PACIFIC CONFERENCE ON CIRCUIT AND SYSTEM (APCCAS), 2010, : 1155 - 1158
- [5] Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels PROCEEDINGS OF THE 25TH INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEM (MIXDES 2018), 2018, : 258 - 261
- [6] Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, 2009, E92A (12): : 2979 - 2989
- [8] A Combination of Evolutionary Algorithm and Mathematical Programming for the 3D Thermal-Aware Floorplanning Problem GECCO-2011: PROCEEDINGS OF THE 13TH ANNUAL GENETIC AND EVOLUTIONARY COMPUTATION CONFERENCE, 2011, : 1731 - 1738
- [10] PRATHAM: A Power Delivery-Aware and Thermal-Aware Mapping Framework for Parallel Embedded Applications on 3D MPSoCs 2014 32ND IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN (ICCD), 2014, : 525 - 528