Thermal-Aware Floorplanning for 3D MPSoCs

被引:0
|
作者
Ayala, Jose L. [1 ]
机构
[1] Univ Complutense Madrid, E-28040 Madrid, Spain
来源
IEEE DESIGN & TEST OF COMPUTERS | 2011年 / 28卷 / 02期
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
引用
收藏
页码:78 / 78
页数:1
相关论文
共 50 条
  • [31] Floorplanning 1024 Cores in a 3D-Stacked Network-on-Chip with Thermal-Aware Redistribution
    Chien, Jui-Hung
    Lung, Chiao-Ling
    Hsu, Chin-Chi
    Chou, Yung-Fa
    Kwai, Ding-Ming
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [32] Thermal-aware Floorplanning and Layout Generation of MOSFET Power Stages
    Guilherme, David
    Pereira, Joao
    Horta, Nuno
    Guilherme, Jorge
    2015 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2015, : 2269 - 2272
  • [33] Thermal-Aware Frequency Scaling for Adaptive Workloads on Heterogeneous MPSoCs
    Yu, Heng
    Syed, Rizwan
    Ha, Yajun
    2014 DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION (DATE), 2014,
  • [34] Placement-aware 3D Floorplanning
    Nain, Rajeev K.
    Chrzanowska-Jeske, Malgorzata
    ISCAS: 2009 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-5, 2009, : 1727 - 1730
  • [35] Thermal-Aware Task Scheduling for Peak Temperature Minimization under Periodic Constraint for 3D-MPSoCs
    Chaturvedi, Vivek
    Singh, Amit
    Zhang, Wei
    Srikanthan, Thambipillai
    PROCEEDINGS OF THE 2014 25TH IEEE INTERNATIONAL SYMPOSIUM ON RAPID SYSTEM PROTOTYPING (RSP): SHORTENING THE PATH FROM SPECIFICATION TO PROTOTYPE, 2014, : 107 - 113
  • [36] A novel thermal-aware structure of TSV cluster in 3D IC
    Hou, Ligang
    Fu, Jingyan
    Wang, Jinhui
    Gong, Na
    MICROELECTRONIC ENGINEERING, 2016, 153 : 110 - 116
  • [37] Thermal-aware 3D Symmetrical Buffered Clock Tree Synthesis
    Oh, Deok Keun
    Choi, Mu Jun
    Kim, Ju Ho
    ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2019, 24 (03)
  • [38] Assessment of Thermal-aware Floorplans in a 3D IC for Server Applications
    Jung, Ki Wook
    Cho, Eunho
    Jo, Sungeun
    Ryu, Seunggeol
    Kim, Jaechoon
    Oh, Dan
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1036 - 1047
  • [39] P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs
    Al Saleh, Dima
    Safari, Yousef
    Amik, Fahad Rahman
    Vaisband, Boris
    2023 IEEE 36TH INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE, SOCC, 2023, : 160 - 165
  • [40] Thermal-aware 3D Symmetrical Buffered Clock Tree Synthesis
    Oh, Deok Keun
    Choi, Mu Jun
    Kim, Ju Ho
    2018 IEEE 36TH INTERNATIONAL CONFERENCE ON COMPUTER DESIGN (ICCD), 2018, : 9 - 16