Diffusion barrier with reactively sputtered TiN for thermally stable contact

被引：0
|
作者：
Mitsuhashi, Katsunori [1 ]
Yamazaki, Osamu [1 ]
Ohtake, Koui [1 ]
Koba, Masayoshi [1 ]
机构：
[1] Sharp Corp, Japan
来源：
| 1600年 / 27期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN
    AHN, KY
    WITTMER, M
    TING, CY
    THIN SOLID FILMS, 1983, 107 (01) : 45 - 54
  • [42] ION BEAM MODIFICATION OF REACTIVELY SPUTTERED TiN THIN FILMS
    Popovic, M.
    Novakovic, M.
    Milosavljevic, M.
    Perusko, D.
    Milinovic, V.
    Radovic, I.
    Bibic, N.
    24TH SUMMER SCHOOL AND INTERNATIONAL SYMPOSIUM ON THE PHYSICS OF IONIZED GASES, CONTRIBUTED PAPERS, 2008, (84): : 205 - 208
  • [43] Effect of Si in reactively sputtered Ti-Si-N films on structure and diffusion barrier performance
    X. Sun
    E. Kolawa
    S. Im
    C. Garland
    M.-A. Nicolet
    Applied Physics A, 1997, 65 : 43 - 45
  • [44] MICROSTRUCTURE OF REACTIVELY SPUTTERED OXIDE DIFFUSION-BARRIERS
    KOLAWA, E
    NIEH, CW
    SO, FCT
    NICOLET, MA
    JOURNAL OF ELECTRONIC MATERIALS, 1988, 17 (05) : 425 - 432
  • [45] Effect of Si in reactively sputtered Ti-Si-N films on structure and diffusion barrier performance
    Sun, X
    Kolawa, E
    Im, S
    Garland, C
    Nicolet, MA
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1997, 65 (01): : 43 - 45
  • [46] Properties of reactively sputtered W–B–N thin film as a diffusion barrier for Cu metallization on Si
    L. C. Leu
    D. P. Norton
    L. McElwee-White
    T. J. Anderson
    Applied Physics A, 2009, 94
  • [47] Ohmic contact to n-GaN with TiN diffusion barrier
    Kaminska, E
    Piotrowska, A
    Guziewicz, M
    Kasjaniuk, S
    Barcz, A
    Dynowska, E
    Bremser, MD
    Nam, OH
    Davis, RF
    III-V NITRIDES, 1997, 449 : 1055 - 1060
  • [48] BIAS EFFECT ON THE MICROSTRUCTURE AND DIFFUSION BARRIER CAPABILITY OF SPUTTERED TIN AND TIOXNY FILMS
    JIN, P
    MARUNO, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (5A): : 1446 - 1452
  • [49] Bias effect on the microstructure and diffusion barrier capability of sputtered TiN and TiOxNy films
    Jin, Ping, 1600, (31):
  • [50] Scanning magnetron-sputtered TIN coating as diffusion barrier for silicon devices
    Lingwal, V
    Panwar, NS
    JOURNAL OF APPLIED PHYSICS, 2005, 97 (10)
12345