共 50 条
- [11] Dependence of diffusion barrier properties in microstructure of reactively sputtered TiN films in Al alloy/TiN/Ti/Si system Appl Surf Sci, (308-311):
- [13] Reactively sputtered vanadium nitride as diffusion barrier for copper interconnect 2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, 2004, : 520 - 523
- [17] Reactively sputtered amorphous MoN film as a diffusion barrier for copper metallization Optoelectronics and Advanced Materials, Rapid Communications, 2011, 5 (01): : 54 - 57
- [18] Reactively sputtered amorphous MoN film as a diffusion barrier for copper metallization OPTOELECTRONICS AND ADVANCED MATERIALS-RAPID COMMUNICATIONS, 2011, 5 (1-2): : 54 - 57
- [19] REACTIVELY SPUTTERED TIN, ZRN, AND HFN JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03): : 580 - 581