共 50 条
- [22] The evaluation of the diffusion barrier performance of reactively sputtered TaNx layers for copper metallization PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2000, : 191 - 193
- [24] PROPERTIES OF DC MAGNETRON REACTIVELY SPUTTERED TIN JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1986, 4 (06): : 1377 - 1382
- [26] Reactively sputtered amorphous TaSixNy films serving as barrier layer against copper diffusion JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (6A): : 4181 - 4186