共 50 条
- [1] DIFFUSION BARRIER WITH REACTIVELY SPUTTERED TIN FOR THERMALLY STABLE CONTACT JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1988, 27 (12): : L2401 - L2403
- [3] Silver metallization with reactively sputtered TiN diffusion barrier flints MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2004, 2004, 812 : 255 - 260
- [7] REACTIVELY SPUTTERED ZRN USED AS AN AL/SI DIFFUSION BARRIER IN A ZR CONTACT TO SILICON JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1984, 2 (02): : 281 - 283
- [9] Properties of reactively sputtered WNx as Cu diffusion barrier Thin Solid Films, 1999, 348 (01): : 299 - 303