Package technology for ASICs

被引：0
|
作者：
Murakami, Gen [1 ]
Hoshi, Akio [1 ]
机构：
[1] Hitachi, Ltd, Japan
来源：
| 1600年 / 39期
关键词：
Integrated Circuits;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Antenna-in-Package (AiP) Technology
    Zhang, Yueping
    ENGINEERING, 2022, 11 : 18 - 20
  • [42] Data analysis for the LISA Technology Package
    Hewitson, M.
    Armano, M.
    Benedetti, M.
    Bogenstahl, J.
    Bortoluzzi, D.
    Bosetti, P.
    Brandt, N.
    Cavalleri, A.
    Ciani, G.
    Cristofolini, I.
    Cruise, M.
    Danzmann, K.
    Diepholz, I.
    Dolesi, R.
    Fauste, J.
    Ferraioli, L.
    Fertin, D.
    Fichter, W.
    Garcia, A.
    Garcia, C.
    Grynagier, A.
    Guzman, F.
    Fitzsimons, E.
    Heinzel, G.
    Hollington, D.
    Hough, J.
    Hueller, M.
    Hoyland, D.
    Jennrich, O.
    Johlander, B.
    Killow, C.
    Lobo, A.
    Mance, D.
    Mateos, I.
    McNamara, P. W.
    Monsky, A.
    Nicolini, D.
    Nicolodi, D.
    Nofrarias, M.
    Perreur-Lloyd, M.
    Plagnol, E.
    Racca, G. D.
    Ramos-Castro, J.
    Robertson, D.
    Sanjuan, J.
    Schulte, M. O.
    Shaul, D. N. A.
    Smit, M.
    Stagnaro, L.
    Steier, F.
    CLASSICAL AND QUANTUM GRAVITY, 2009, 26 (09)
  • [43] A LABORATORY PACKAGE FOR TRAINING IN VACUUM TECHNOLOGY
    HARRIS, NS
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (04): : 1408 - 1411
  • [44] RF Technology in a Complete Glass Package
    Schmidt, Stephan
    Advancing Microelectronics, 2021, 48 (03): : 12 - 13
  • [45] Deep Considerations on LED Package Technology
    Li Kunzhui
    Xu Shaohua
    Tang Yuchuang
    Weng Xiangze
    Wang Yi
    2015 12TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (SSLCHINA), 2015, : 8 - 11
  • [46] Technology driven component package trends
    Prasad, Ray
    Semiconductor International, 1996, 19 (04)
  • [47] INTERMEDIATE-TECHNOLOGY AND PACKAGE DEAL
    FIELD, F
    APPROPRIATE TECHNOLOGY, 1977, 4 (03) : 11 - 12
  • [48] Big emissions technology in small package
    Brezonick, M
    DIESEL PROGRESS NORTH AMERICAN EDITION, 2004, 70 (03): : 48 - 49
  • [49] The LISA Technology Package dynamics and control
    Bortoluzzi, D
    Da Lio, M
    Dolesi, R
    Weber, W
    Vitale, S
    CLASSICAL AND QUANTUM GRAVITY, 2003, 20 (10) : S227 - S238
  • [50] Plastic SMD package technology for accelerometers
    Stalnaker, WM
    Spangler, LC
    Fehr, GS
    Fujimoto, G
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 197 - 202
12345