共 50 条
- [1] A complete lubrication package for glass manufacturing Glass International, 2021, 44 (08): : 37 - 38
- [3] BGA package technology considerations for High Speed and RF applications 2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
- [4] Glass direct bonding technology for hermetic seal package MEMS 97, PROCEEDINGS - IEEE THE TENTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND ROBOTS, 1997, : 186 - 190
- [6] Design and Implementation of a Dual-band RF SiP Module based on Package-on-Package Technology 2018 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT2018), 2018,