RF Technology in a Complete Glass Package

被引:0
|
作者
Schmidt, Stephan [1 ]
机构
[1] LPKF Lasers and Electronics
来源
Advancing Microelectronics | 2021年 / 48卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:12 / 13
相关论文
共 50 条
  • [1] A complete lubrication package for glass manufacturing
    Clarkson, Andrew
    Glass International, 2021, 44 (08): : 37 - 38
  • [2] SPRAYABLE RIM - NOW ITS A COMPLETE TECHNOLOGY PACKAGE
    不详
    PLASTICS TECHNOLOGY, 1985, 31 (04) : 24 - &
  • [3] BGA package technology considerations for High Speed and RF applications
    Marechal, Laurent
    Auchere, David
    Imbs, Yvon
    2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
  • [4] Glass direct bonding technology for hermetic seal package
    Ando, D
    Oishi, K
    Nakamura, T
    Umeda, S
    MEMS 97, PROCEEDINGS - IEEE THE TENTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND ROBOTS, 1997, : 186 - 190
  • [5] A complete RF power technology assessment for military applications
    Moreau, C.
    Le Helleye, P.
    Ruelloux, D.
    MICROELECTRONICS RELIABILITY, 2006, 46 (9-11) : 1817 - 1822
  • [6] Design and Implementation of a Dual-band RF SiP Module based on Package-on-Package Technology
    Liu, Jianfeng
    Wang, Bo
    Zhou, Yang
    Chen, Lijie
    Duan, Zongming
    Ma, Qiang
    2018 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT2018), 2018,
  • [7] The complete package
    Engineering, 2023, (April): : 34 - 35
  • [8] Complete Package
    Haarsma, Durk
    GIM INTERNATIONAL-THE WORLDWIDE MAGAZINE FOR GEOMATICS, 2014, 28 (07): : 3 - 3
  • [9] Complete package
    DES Diesel Equip Supt, 5 (48):
  • [10] The complete package
    Flexo, 2001, 26 (03): : 22 - 28