共 50 条
- [26] Integrated Low Loss RF Passive Components on Glass Interposer Technology 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 308 - 313
- [27] Package on Package SMT rework technology 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [29] A novel MCM package for RF applications TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 225 - 231
- [30] Verification of BGA package in RF application Piers 2007 Beijing: Progress in Electromagnetics Research Symposium, Pts I and II, Proceedings, 2007, : 179 - 181