Package technology for ASICs

被引：0

作者：

Murakami, Gen ^{[1
]}

Hoshi, Akio ^{[1
]}

机构：

[1] Hitachi, Ltd, Japan

来源：

| 1600年 / 39期

关键词：

Integrated Circuits;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

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