Pattern Transfer for van der Waals Integration

Atomically thin two-dimensional materials are promising candidates for designing functional electronic and optical devices through van der Waals integration. However, the route toward advanced devices typically involves transferring all prefabricated source materials onto target substrates, with significant reliance on post-transfer masking and etching operations to remove undesirable components. The existing transfer technologies are based on spin-coated polymeric carriers lacking controllable geometry, thereby limiting their ability to selectively transfer only the designated components of the source materials. Here, we introduce a pattern transfer technology for picking out the desired components from source materials on demand by rapidly patterning scalable polymeric transfer carriers into the required shapes and sizes. Patterned carriers provide the advantages of twist-angle controllability and one-step preparation of ready-to-transfer electrodes, enabling the formation of supermoire homostructures and van der Waals electrical contacts. These capabilities of the pattern transfer technology offer great potential for the design and versatile integration of multifunctional van der Waals devices and drive forward the industrial application of two-dimensional materials.