Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection

被引：0
|
作者：
Graduate School of Information Science and Electrical Engineering, Kyushu University, 744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan [1 ]
机构：
来源：
Jpn. J. Appl. Phys. | / 4 PART 2卷
关键词：
Compendex;
D O I：
04DB02
中图分类号：
学科分类号：
摘要：
Electrodes
引用
收藏
相关论文
共 50 条
  • [31] Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation
    Wang, Chenxi
    Suga, Tadatomo
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (05) : H525 - H529
  • [32] Investigation for Room Temperature Bonding Using Mechanical Caulking Method with Blind-Via-Hole of FPC and Stud Bump and Blind-Via-Hole
    Yoshimura Y.
    Aono T.
    Sako A.
    Sato M.
    Fukada M.
    Tomotsune H.
    Journal of Japan Institute of Electronics Packaging, 2021, 24 (06) : 572 - 579
  • [33] Fabrication of VGA Size Near-Infrared Image Sensor using Room-Temperature Flip-Chip Bonding Technology
    Shuto, Takanori
    Iwanabe, Keiichiro
    Ogura, Mutsuo
    Nishida, Katsuhiko
    Asano, Tanemasa
    2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 536 - 539
  • [34] Room-Temperature Wafer Direct Bonding Using Surface Smoothing by Ion Beam
    Takagi, Hideki
    Kurashima, Yuichi
    Maeda, Atsuhiko
    Journal of Japan Institute of Electronics Packaging, 2015, 18 (07) : 469 - 473
  • [35] Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles
    Tanaka, Shuji
    Mohri, Mamoru
    Ogashiwa, Toshinori
    Fukushi, Hideyuki
    Tanaka, Katsunao
    Nakamura, Daisuke
    Nishimori, Takashi
    Esashi, Masayoshi
    SENSORS AND ACTUATORS A-PHYSICAL, 2012, 188 : 198 - 202
  • [36] Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints
    Kim, Yang Ho
    Ma, Sung Woo
    Kim, Young-Ho
    JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (09) : 3296 - 3306
  • [37] Technological and Electrical Performances of Ultrafine-Pitch Flip-Chip Assembly Based on Room-Temperature Vertical Interconnection
    Fendler, Manuel
    Marion, Francois
    Saint Patrice, Damien
    Mandrillon, Vincent
    Berger, Frederic
    Ribot, Herve
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (03): : 291 - 298
  • [38] Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints
    Yang Ho Kim
    Sung Woo Ma
    Young-Ho Kim
    Journal of Electronic Materials, 2014, 43 : 3296 - 3306
  • [39] Effect of surface roughness on room-temperature wafer bonding by Ar beam surface activation
    Mechanical Engineering Lab, Ibaraki, Japan
    Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap, 7 (4197-4203):
  • [40] Effect of the surface treatment on the room-temperature bonding of Al to Si and SiO2
    N Hosoda
    Y Kyogoku
    T Suga
    Journal of Materials Science, 1998, 33 : 253 - 258
12345