Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection

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作者：
Graduate School of Information Science and Electrical Engineering, Kyushu University, 744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan [1 ]
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来源：
Jpn. J. Appl. Phys. | / 4 PART 2卷
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Compendex;
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04DB02
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摘要：
Electrodes
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