共 50 条
- [22] Trends in microelectronics packaging and interconnection ICSE '96 - 1996 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS, 1996, : A1 - A5
- [25] PACKAGING AND ASSEMBLING TECHNIQUE IN MICROELECTRONICS ELECTRONICS & COMMUNICATIONS IN JAPAN, 1966, 49 (04): : 127 - &
- [26] THE MICROELECTRONICS APPLICATIONS OF DIFFERENTIAL SCANNING CALORIMETRY FOR PACKAGING AND MATERIALS - INCLUDING SOLDER PASTES MICROELECTRONICS AND RELIABILITY, 1985, 25 (01): : 9 - 16
- [27] Trends in RF module packaging for wireless applications 2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 82 - 86
- [29] Electrical Properties of Epoxy-Nano Diamond Composite Films for Microelectronics Packaging Applications 2024 IEEE LATIN AMERICAN ELECTRON DEVICES CONFERENCE, LAEDC, 2024,