共 50 条
- [43] ELECTRONIC PACKAGING AND CORROSION - FORECAST - CORROSION IN MICROELECTRONICS MICROPROCESSING AND MICROPROGRAMMING, 1987, 19 (05): : 427 - 427
- [44] Study of a laser microwelding process for microelectronics and packaging 2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 713 - 716
- [45] Future direction and challenges for microelectronics packaging materials ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1875 - 1880
- [47] PREENCAPSULATION CLEANING METHODS AND CONTROL FOR MICROELECTRONICS PACKAGING IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (04): : 542 - 552
- [49] Characterization of Moisture Uptake in Microelectronics Packaging Materials 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
- [50] THE MICROELECTRONICS PACKAGING PROGRAM AT LEHIGH-UNIVERSITY JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1991, 43 (06): : 49 - 50