Why microelectronics and packaging? Wireless applications

被引：0
|
作者：
机构：
来源：
| 2001年 / IMAPS-International Microelectronics and Packaging Society, Washington, United States卷 / 28期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
No abstract available
引用
收藏
相关论文
共 50 条
  • [31] Emerging Materials Challenges in Microelectronics Packaging
    D. R. Frear
    S. Thomas
    MRS Bulletin, 2003, 28 : 68 - 74
  • [32] Packaging techniques for modern microelectronics equipment
    ROBERTSON FA
    Electronics and Power, 1971, 17 : 406 - 409
  • [33] Simulating underfill flow for microelectronics packaging
    Iwamoto, N
    Nakagawa, M
    Mustoe, GGW
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 294 - 301
  • [34] Journal of Microelectronics and Electronic Packaging: Editorial
    Bokil, Delip
    Journal of Microelectronics and Electronic Packaging, 2005, 2 (04):
  • [35] Journal of Microelectronics and Electronic Packaging: Editorial
    Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109, United States
    J. Microelectron. Electron. Packag., 2007, 4 (0i):
  • [36] HIGH-PERFORMANCE PACKAGING IN MICROELECTRONICS
    BLODGETT, AJ
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03): : 777 - 778
  • [37] How Microelectronics and Nanotechnology Will Shape Packaging
    Brody, Aaron L.
    FOOD TECHNOLOGY, 2012, 66 (02) : 73 - 75
  • [38] MODELING JOINING MATERIALS FOR MICROELECTRONICS PACKAGING
    KIVILAHTI, JK
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 326 - 333
  • [39] Electrically Conductive Adhesives in Microelectronics Packaging
    Ayalasomayajula, Mukund
    Khurana, Mohit Ravi
    Chaudhary, Prince Shiva
    JOURNAL OF ELECTRONIC PACKAGING, 2024, 146 (04)
  • [40] Motile microelectronics with wireless power
    Xu, Changhao
    Gao, Wei
    NATURE ELECTRONICS, 2020, 3 (03) : 139 - 140
12345