Trends in RF module packaging for wireless applications

被引：0
|
作者：
Bachner, FJ [1 ]
Vardaman, EJ [1 ]
Kale, V [1 ]
机构：
[1] TechSearch Int Inc, Austin, TX 78759 USA
来源：
2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING | 2000年 / 4217卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The design and fabrication of RF modules for the coming generations of wireless systems present new challenges associated with the materials for RF module substrates operating at high frequencies. Technologies being considered for these substrates are organic laminates, low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC), and thin-film on silicon. A key driver in the choice of substrate technology is its ability to provide embedded passives. Efforts are underway to develop higher-performance embedded passive technology for organic laminate substrates. LTCC modules with integrated passives are commercially available, and thin-film-on-silicon substrates from several sources have demonstrated integrated R, C & L components.
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页码：82 / 86
页数：5
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