Trends in RF module packaging for wireless applications

The design and fabrication of RF modules for the coming generations of wireless systems present new challenges associated with the materials for RF module substrates operating at high frequencies. Technologies being considered for these substrates are organic laminates, low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC), and thin-film on silicon. A key driver in the choice of substrate technology is its ability to provide embedded passives. Efforts are underway to develop higher-performance embedded passive technology for organic laminate substrates. LTCC modules with integrated passives are commercially available, and thin-film-on-silicon substrates from several sources have demonstrated integrated R, C & L components.