共 50 条
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- [3] Enabling ceramic circuit technologies for wireless microelectronics packaging 1997 WIRELESS COMMUNICATIONS CONFERENCE, PROCEEDINGS, 1997, : 156 - 161
- [4] LEAD FREE MICROELECTRONICS PACKAGING FOR BIOMEDICAL APPLICATIONS JOURNAL OF OPTOELECTRONIC AND BIOMEDICAL MATERIALS, 2009, 1 (03): : 241 - 248
- [5] Advances in polymeric materials used for microelectronics packaging applications ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2006, 231
- [6] Fluorinated aromatic polyimides for advanced microelectronics packaging applications ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 66 - +
- [8] High density microelectronics packaging roadmap for space applications PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 91 - 96
- [10] Laser processing of adhesives and polymeric materials for microelectronics packaging applications 4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 289 - 295