MICROELECTRONICS PACKAGING

被引：0

|

作者：

KRAUSKOPF, B

机构：

来源：

MANUFACTURING ENGINEERING | 1982年 / 89卷 / 04期

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D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

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页码：71 / 73

页数：3

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