BENDING OF SILICON WAFERS BY THIN POLYCRYSTALLINE SILICON FILM DEPOSITION AND BY FILM DOPING USING BORON-DIFFUSION

被引：6

作者：

TONCHEVA, LT ^{[1
]}

VASSILEV, IS ^{[1
]}

机构：

[1] INST SOLID STATE PHYS,BU-1113 SOFIA,BULGARIA

来源：

THIN SOLID FILMS | 1979年 / 60卷 / 03期

关键词：

D O I：

10.1016/0040-6090(79)90081-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：353 / 359

页数：7

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