BENDING OF SILICON WAFERS BY THIN POLYCRYSTALLINE SILICON FILM DEPOSITION AND BY FILM DOPING USING BORON-DIFFUSION

被引：6
|
作者：
TONCHEVA, LT [1 ]
VASSILEV, IS [1 ]
机构：
[1] INST SOLID STATE PHYS,BU-1113 SOFIA,BULGARIA
来源：
THIN SOLID FILMS | 1979年 / 60卷 / 03期
关键词：
D O I：
10.1016/0040-6090(79)90081-6
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：353 / 359
页数：7
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