FORUM ON IC PACKAGING PANELS

被引：0

作者：

BALDE, J

BEST, D

FREEHAUF, G

GRUBB, D

HUNTER, R

KOPPEL, H

LEARY, B

LEE, R

LOMBARDI, E

MAZZEO, R

MCGARVEY, T

MESSNER, G

PAHUTSKI, L

PEEL, M

PENLAND, F

SAHELEY, C

SCHMIDT, R

WHITEHEAD, R

WILLMINGTON, G

机构：

[1] HUGHES AIRCRAFT CO,DESIGN SUPPORT GRP,CULVER CITY,CA 90230

[2] SCANBE,EL MONTE,CA 91731

[3] AUGAT INC,ATTLEBORO,MA

[4] GARRY MFG CO,NEW BRUNSWICK,NJ 08902

[5] TEXAS INSTRUMENTS INC,DALLAS,TX 75222

[6] DIGITAL EQUIPMENT CORP,MAYNARD,MA 01754

[7] GARDNER DENVER CO,GRAND HAVEN,MI 49417

[8] MOORE SYST,SUNNYVALE,CA

[9] INT TEL & TELEG,NEW YORK,NY

来源：

ELECTRONIC PRODUCTS MAGAZINE | 1979年 / 21卷 / 09期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：27 / 36

页数：10

共 50 条

[1] Packaging forum
Forcinio, Hallie
Pharmaceutical Technology, 1994, 18 (05):
[2] NATIONAL PACKAGING FORUM
不详
SOAP AND CHEMICAL SPECIALITIES, 1969, 45 (11): : 93 - &
[3] Trends in IC Packaging
Beelen-Hendrikx, Caroline
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 12 - 19
[4] Evolution of IC packaging
Electronic Packaging and Production, 1998, 38 (08):
[5] Merging PCBs and IC packaging
Merix Corp, Forest Grove, United States
Aufbereit Tech Miner Process, 4 (26, 28 29):
[6] Fatigue Analysis of IC Packaging
Pereira de Lima, Vanessa Davanco
Pacheco Rotondaro, Antonio Luis
2015 30TH SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO), 2015,
[7] FIGURE OF MERIT FOR IC PACKAGING
KEYES, RW
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1978, 13 (02) : 265 - 266
[8] IS THERE A BEST IC PACKAGING SYSTEM
DOWDELL, E
ELECTRONIC PRODUCTS MAGAZINE, 1973, 16 (05): : 53 - &
[9] The bifurcation of advanced IC packaging
Park, John
Advancing Microelectronics, 2020, 47 (01): : 6 - 8
[10] IC packaging: Managing the choices
Electronic Packaging and Production, 39 (10):