ENCAPSULANTS REAP NEW USES FOR CHIP-ON-BOARD TECHNOLOGY

被引：0
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作者：
CHIN, S
机构：
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1990年 / 32卷 / 10期
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：22 / 22
页数：1
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