A thin film thermoelectric cooler for Chip-on-Board assembly

被引：5

作者：

Kim, Shiho ^{[1
]}

Lee, Hyunju ^{[1
]}

Kim, Namjae ^{[1
]}

Yoo, Jungho ^{[1
]}

机构：

[1] Chungbuk Natl Univ, Dept Elect Engn, Cheongju 361763, Chungbuk, South Korea

来源：

IEICE ELECTRONICS EXPRESS | 2010年 / 7卷 / 21期

关键词：

thermoelectric cooler; Chip-on-Board cooling; PWM Driver of TEC;

D O I：

10.1587/elex.7.1615

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have proposed and demonstrated an embedded thin film thermoelectric cooler attached between die chip and metal plate for Chip-on-Board (COB) direct assembly. The proposed structure of COB cooler was modeled by electrical equivalent circuit for SPICE simulation including operational heat generation of chip and PWM control of input power supply. The optimum input power of the TEC to achieve maximum temperature difference between chip and heat sink was simulated by using the proposed equivalent circuit. The measured and simulated results offer the possibility of thin film active cooling for COB direct assembly.

引用

页码：1615 / 1621

页数：7

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