CHIP-ON-BOARD: AN ECONOMICAL PACKAGING SOLUTION.

被引：0
|
作者：
Fuchs, Edward [1 ]
机构：
[1] Photocircuits, Glen Cove, NY, USA, Photocircuits, Glen Cove, NY, USA
来源：
Electronic Packaging and Production | 1985年 / 25卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：182 / 185
相关论文
共 50 条
  • [1] Millimeter-Wave Chip-on-Board Integration and Packaging
    Stoneham, Edward B.
    RF AND MICROWAVE MICROELECTRONICS PACKAGING, 2010, : 69 - 90
  • [2] Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy
    Lawton, W
    Barrett, J
    MICROELECTRONICS AND RELIABILITY, 1996, 36 (11-12): : 1803 - 1806
  • [3] Design of optical structure for chip-on-board wafer level packaging LEDs
    Ma, Jian-She
    He, Li-Yun
    Liu, Tong
    Su, Ping
    Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2013, 21 (04): : 904 - 910
  • [4] Thermal performance comparison of chip-on-board, flip chip-on-board and standard TQFP package
    Iliev, SK
    FOURTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1998, : 161 - 168
  • [5] The chip-on-board LED module
    Mok, Thye-Linn
    PHOTONICS SPECTRA, 2008, 42 (01) : 56 - +
  • [6] Going mainstream with chip-on-board
    Luthra, Mukul
    Circuits Assembly, 2002, 13 (01): : 33 - 44
  • [7] A CPU CHIP-ON-BOARD MODULE
    TANAKA, A
    SHINOHARA, H
    YAMADA, K
    HONDA, M
    HATADA, T
    YAMAGIWA, A
    SHIRAI, Y
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01): : 115 - 118
  • [8] The chip-on-board LED module
    Avago Technologies, Penang, Malaysia
    Photonics Spectra, 2008, 1 (56-59)
  • [9] Effect of Patterned Substrate on Light Extraction Efficiency of Chip-on-Board Packaging LEDs
    Zheng, Huai
    Zhao, Zhili
    Wang, Yiman
    Li, Lang
    Liu, Sheng
    Luo, Xiaobing
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1876 - 1879
  • [10] Research Note: LED chip-on-board packaging technology for strict colour tolerance
    Zhang, J.
    Ge, P.
    Zhou, Z.
    Liu, D.
    Wang, H.
    Su, J.
    LIGHTING RESEARCH & TECHNOLOGY, 2017, 49 (08) : 1052 - 1057
12345