HIGH-DENSITY AND REDUCED LATCHUP SUSCEPTIBILITY CMOS TECHNOLOGY FOR VLSI

被引:7
|
作者
MANOLIU, J
TSENG, FH
WOO, BJ
MEIER, TJ
机构
关键词
D O I
10.1109/EDL.1983.25716
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:233 / 235
页数:3
相关论文
共 50 条
  • [31] A CMOS STRUCTURE WITH HIGH LATCHUP HOLDING VOLTAGE
    HU, GJ
    BRUCE, RH
    IEEE ELECTRON DEVICE LETTERS, 1984, 5 (06) : 211 - 214
  • [32] TECHNOLOGY AND APPLICATIONS OF HIGH-DENSITY SENSORS
    KHOSLA, RP
    MICROELECTRONIC ENGINEERING, 1992, 19 (1-4) : 615 - 622
  • [33] A three-dimensional stacked Fin-CMOS technology for high-density ULSI circuits
    Wu, XS
    Chan, PCH
    Zhang, SD
    Feng, CG
    Chan, M
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2005, 52 (09) : 1998 - 2003
  • [34] IMPROVED PHYSICAL DESIGN-MODEL FOR LATCHUP ANALYSIS OF VLSI-CMOS CIRCUITS
    STRZEMPADEPRE, M
    HARTER, J
    WERNER, C
    SKAPA, H
    KASSING, R
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (03) : C105 - C105
  • [35] QUASI-2-DIMENSIONAL SIMULATION OF TRANSIENT LATCHUP EFFECT IN VLSI CMOS CIRCUITS
    HARTER, J
    JACOBS, H
    ZWAR, M
    SKAPA, H
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (09) : 1665 - 1668
  • [36] Cell recordings with a CMOS high-density microelectrode array
    Frey, U.
    Sanchez-Bustamante, C. D.
    Ugniwenko, T.
    Heer, F.
    Sedivy, J.
    Hafizovic, S.
    Roscic, B.
    Fussenegger, M.
    Blau, A.
    Egert, U.
    Hierlemann, A.
    2007 ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOLS 1-16, 2007, : 167 - +
  • [37] MODELING DEVICE ISOLATION IN HIGH-DENSITY CMOS.
    Xerox, Palo Alto, CA, USA, Xerox, Palo Alto, CA, USA
    Electron device letters, 1986, EDL-7 (02): : 64 - 65
  • [38] A 70NS HIGH-DENSITY CMOS DRAM
    CHWANG, R
    CHOI, M
    CREEK, D
    STERN, S
    PELLEY, P
    SCHUTZ, J
    BOHR, M
    WARKENTIN, P
    YU, K
    ISSCC DIGEST OF TECHNICAL PAPERS, 1983, 26 : 56 - &
  • [39] SINGLE EVENT EFFECTS IN HIGH-DENSITY CMOS SRAMS
    SHIONO, N
    SAKAGAWA, Y
    SEKIGUCHI, M
    SATO, K
    SUGAI, I
    HATTORI, T
    HIRAO, Y
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1986, 33 (06) : 1632 - 1636
  • [40] HIGH-DENSITY, 0.35MICRON CMOS ASICS
    不详
    ELECTRONIC PRODUCT DESIGN, 1995, 16 (06): : 13 - 13