HIGH-DENSITY AND REDUCED LATCHUP SUSCEPTIBILITY CMOS TECHNOLOGY FOR VLSI

被引：7
|
作者：
MANOLIU, J
TSENG, FH
WOO, BJ
MEIER, TJ
机构：
来源：
IEEE ELECTRON DEVICE LETTERS | 1983年 / 4卷 / 07期
关键词：
D O I：
10.1109/EDL.1983.25716
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：233 / 235
页数：3
相关论文
共 50 条
  • [41] HIGH-DENSITY CENTRAL I/O CIRCUITS FOR CMOS
    MASLEID, RP
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1991, 26 (03) : 431 - 435
  • [42] GATED ISOLATION STRUCTURE FOR HIGH-DENSITY, HIGH-SPEED RADIATION-HARDENED BULK CMOS TECHNOLOGY
    CHEN, HH
    HSU, JJ
    LIANG, WC
    WANG, HY
    HUANG, FJ
    CHOU, TG
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (03) : C129 - C129
  • [43] High density VLSI implementation of a bipolar CNN with reduced programmability
    Paasio, A
    Flak, J
    Laiho, M
    Halonen, K
    2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 3, PROCEEDINGS, 2004, : 21 - 24
  • [44] The influence of VLSI technology evolution on radiation-induced latchup in space systems
    Johnston, AH
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1996, 43 (02) : 505 - 521
  • [45] HIGH-PERFORMANCE LATCHUP-FREE CMOS
    SANGIORGI, E
    SWIRHUN, S
    PINTO, M
    RAFFERTY, C
    SARASWAT, K
    DUTTON, R
    SWANSON, R
    WEEKS, A
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (12) : 1967 - 1967
  • [46] Influence of VLSI technology evolution on radiation-induced latchup in space systems
    Jet Propulsion Lab, Pasadena, United States
    IEEE Trans Nucl Sci, 2 pt 1 (505-521):
  • [47] New high-density multilayer technology on PCB
    Shimoto, T
    Matsui, K
    Kikuchi, K
    Shimada, Y
    Utsumi, K
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (02): : 116 - 122
  • [48] Reviews and prospects of high-density RAM technology
    Itoh, K
    Watanabe, T
    Kimura, S
    Sakata, T
    2000 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, CAS 2000 PROCEEDINGS, 2000, : 13 - 22
  • [49] Silicon interposer technology for high-density package
    Matsuo, M
    Hayasaka, N
    Okumura, K
    Hosomi, E
    Takubo, C
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1455 - 1459
  • [50] A HIGH-DENSITY RECORDING TECHNOLOGY FOR DIGITAL VCRS
    KANOTA, K
    INOUE, H
    UETAKE, A
    KAWAGUCHI, M
    CHIBA, K
    KUBOTA, Y
    IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 1990, 36 (03) : 540 - 547
12345