HIGH THROUGHPUT SUB-MICRON LITHOGRAPHY WITH ELECTRON-BEAM PROXIMITY PRINTING

被引：0

作者：

BOHLEN, H ^{[1
]}

BEHRINGER, U ^{[1
]}

KEYSER, J ^{[1
]}

NEHMIZ, P ^{[1
]}

ZAPKA, W ^{[1
]}

KULCKE, W ^{[1
]}

机构：

[1] IBM DEUTSCHLAND GMBH,GERMAN MFG TECHNOL CTR,MFG INSTRUMENTS GRP,SINDELFINGEN,FED REP GER

来源：

SOLID STATE TECHNOLOGY | 1984年 / 27卷 / 09期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：210 / 217

页数：8

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