Observations of continuous tin whisker growth in NdSn3 intermetallic compound

被引:23
|
作者
Xian, Ai-Ping [1 ]
Liu, Meng [1 ]
机构
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
基金
美国国家科学基金会;
关键词
SN; MECHANISM; SURFACE; CU;
D O I
10.1557/JMR.2009.0334
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In situ observation of tin whisker growth in NdSn3 compound was carried out by using an optical microscope (OM) and scanning electron microscopy (SEM). The growth rate of Sn-whisker from NdSn3 is shown to be rapid (approximately 8-15 A/s) during exposure to room ambience, and it is accompanied by formation of a new compound, Nd(OH)(3), as was confirmed by x-ray diffraction. This reaction between the Sn-RE compound and trace water in room ambience has significant influence on whisker growth. There is an electron irradiation effect on whisker growth; that is, whiskers stopped growing after being observed in SEM. Therefore, it is suggested that OM be used rather than SEM to observe the continuous whisker growth. In discussion, the driving force per Sn atom for whisker growth is estimated as 1 x 10(14) N in accordance with the whisker growth rate, and its apparent force originates from a chemical potential gradient between the released Sri atoms and the whisker.
引用
收藏
页码:2775 / 2783
页数:9
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