Observations of continuous tin whisker growth in NdSn3 intermetallic compound

被引:23
|
作者
Xian, Ai-Ping [1 ]
Liu, Meng [1 ]
机构
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
基金
美国国家科学基金会;
关键词
SN; MECHANISM; SURFACE; CU;
D O I
10.1557/JMR.2009.0334
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In situ observation of tin whisker growth in NdSn3 compound was carried out by using an optical microscope (OM) and scanning electron microscopy (SEM). The growth rate of Sn-whisker from NdSn3 is shown to be rapid (approximately 8-15 A/s) during exposure to room ambience, and it is accompanied by formation of a new compound, Nd(OH)(3), as was confirmed by x-ray diffraction. This reaction between the Sn-RE compound and trace water in room ambience has significant influence on whisker growth. There is an electron irradiation effect on whisker growth; that is, whiskers stopped growing after being observed in SEM. Therefore, it is suggested that OM be used rather than SEM to observe the continuous whisker growth. In discussion, the driving force per Sn atom for whisker growth is estimated as 1 x 10(14) N in accordance with the whisker growth rate, and its apparent force originates from a chemical potential gradient between the released Sri atoms and the whisker.
引用
收藏
页码:2775 / 2783
页数:9
相关论文
共 50 条
  • [21] Rapid Growth of Tin Whisker on Surface of ErSn3 Phase
    Hao Hu
    Shi Yaowu
    Xia Zhidong
    Lei Yongping
    Guo Fu
    Li Xiaoyan
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 (08) : 1419 - 1422
  • [22] A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase
    Hu Hao
    Guangchen Xu
    Yonglun Song
    Yaowu Shi
    Fu Guo
    Journal of Electronic Materials, 2012, 41 : 184 - 189
  • [23] Evidence of 3D strain gradients associated with tin whisker growth
    Hektor, Johan
    Marijon, Jean-Baptiste
    Ristinmaa, Matti
    Hall, Stephen A.
    Hallberg, Hakan
    Iyengar, Srinivasan
    Micha, Jean-Sebastien
    Robach, Odile
    Grennerat, Fanny
    Castelnau, Olivier
    SCRIPTA MATERIALIA, 2018, 144 : 1 - 4
  • [24] A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase
    Hao, Hu
    Xu, Guangchen
    Song, Yonglun
    Shi, Yaowu
    Guo, Fu
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (02) : 184 - 189
  • [25] Crystal growth of Gd2PdSi3 intermetallic compound
    Xu, Yi-ku
    Loeser, Wolfgang
    Guo, Ya-jie
    Zhao, Xin-bao
    Liu, Lin
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2014, 24 (01) : 115 - 119
  • [26] Crystal growth of the Pr2PdSi3 intermetallic compound
    Xu, Y.
    Loeser, W.
    Behr, G.
    Frontzek, M.
    Tang, F.
    Buechner, B.
    Liu, L.
    JOURNAL OF CRYSTAL GROWTH, 2010, 312 (12-13) : 1992 - 1996
  • [27] Crystal growth of the intermetallic compound Nd2PdSi3
    Xu, Y.
    Loeser, W.
    Tang, F.
    Blum, C. G. F.
    Liu, L.
    Buechner, B.
    CRYSTAL RESEARCH AND TECHNOLOGY, 2011, 46 (02) : 135 - 139
  • [28] Single crystal growth of the Er2PdSi3 intermetallic compound
    Mazilu, I.
    Frontzek, M.
    Loeser, W.
    Behr, G.
    Teresiak, A.
    Schultz, L.
    JOURNAL OF CRYSTAL GROWTH, 2005, 275 (1-2) : E103 - E107
  • [29] Growth kinetics of antiphase domain in Ti3Al intermetallic compound
    Koizumi, Y
    Katsumura, H
    Minamino, Y
    Tsuji, N
    Lee, JG
    Mori, H
    SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2004, 5 (1-2) : 19 - 28
  • [30] The growth of Ag3Sn intermetallic compound under a temperature gradient
    Su, Yu-Ping
    Ouyang, Fan-Yi
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 634 - 639