Rapid Growth of Tin Whisker on Surface of ErSn3 Phase

被引：0

作者：

Hao Hu ^{[1
]}

Shi Yaowu ^{[1
]}

Xia Zhidong ^{[1
]}

Lei Yongping ^{[1
]}

Guo Fu ^{[1
]}

Li Xiaoyan ^{[1
]}

机构：

[1] Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2010年 / 39卷 / 08期

关键词：

lead-free solder; rare earth Er; tin whiskers; SN; CU;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Tin whisker growth on the surface of ErSn3 phase was investigated during air and vacuum aging of ErSn3, respectively. The results indicate that tin whisker growth occurs on the surface of the oxidized ErSn3 phase during air aging. Moreover, the growth rate is slow and the distribution is uneven during room temperature aging; on the contrary, the growth rate of tin whiskers is fast and the distribution is even during 150 degrees C aging; however, no tin whisker is found on the surface of ErSn3 phase during vacuum aging. The volume expansion which is caused by diffusion of oxygen atoms into ErSn3 lattice during oxidization in air produces compressive stress that provides the driving force for tin whisker growth; thus tin whisker growth happens during air aging and no whisker is found during vacuum aging.

引用

页码：1419 / 1422

页数：4

共 12 条

[1] Whisker and hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits
Boettinger, WJ
Johnson, CE
Bendersky, LA
Moon, KW
Williams, ME
Stafford, GR
[J]. ACTA MATERIALIA, 2005, 53 (19) : 5033 - 5050
[2] Ellis W.C., 1958, Growth and Perfection of Crystals, P102
[3] A TENTATIVE THEORY OF METALLIC WHISKER GROWTH
ESHELBY, JD
[J]. PHYSICAL REVIEW, 1953, 91 (03): : 755 - 756
[4] ACCELERATED GROWTH OF TIN WHISKERS
FISHER, RM
DARKEN, LS
CARROLL, KG
[J]. ACTA METALLURGICA, 1954, 2 (03): : 368 - &
[5] FRANK FC, 1953, PHILOS MAG, V44, P854
[6] Hao H, 2006, RARE METAL MAT ENG, V35, P121
[7] A TENTATIVE EXPLANATION OF THE ACCELERATED GROWTH OF TIN WHISKERS
HASIGUTI, RR
[J]. ACTA METALLURGICA, 1955, 3 (02): : 200 - 201
[8] MECHANISM OF GROWTH OF WHISKERS ON CADMIUM
PEACH, MO
[J]. JOURNAL OF APPLIED PHYSICS, 1952, 23 (12) : 1401 - 1403
[9] Stress analysis of spontaneous Sn whisker growth
Tu, K. N.
Chen, Chih
Wu, Albert T.
[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 269 - 281
[10] IRREVERSIBLE-PROCESSES OF SPONTANEOUS WHISKER GROWTH IN BIMETALLIC CU-SN THIN-FILM REACTIONS
TU, KN
[J]. PHYSICAL REVIEW B, 1994, 49 (03): : 2030 - 2034

← 1 2 →