Ceramics bonding using solder glass frit

被引：0
|
作者：
Z. Sun
D. Pan
J. Wei
C. K. Wong
机构：
[1] Singapore Institute of Manufacturing Technology,
来源：
Journal of Electronic Materials | 2004年 / 33卷
关键词：
Ceramics; bonding; surface treatment; solder glass frit; processing parameters; surface roughness; surface-contact angle;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Ceramics bonding is becoming an important technology and has found wide applications in different engineering and electronic industries. In this paper, furnace bonding of ceramics using solder glass frit was investigated with emphasis on the effects of surface treatment and bonding conditions on bonding strength. Alumina (Al2O3) sheet and SCHOTT solder glass G017-393 were used as the base and brazing filler materials, respectively. Chemical surface treatments using various acids were tested. The results reveal the effects of spreading and voids on bonding strength. An optimum bonding strength can be produced by an appropriate combination of bonded glass-frit density and spreading area. Bonding strength is not only related to surface-contact angle but also surface roughness. The study shows that high-quality ceramics bonding or sealing can be achieved with the application of appropriate bonding conditions.
引用
收藏
页码：1516 / 1523
页数：7
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