Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

被引：117

作者：

Liu, Xiangdong ^{[1
,2
]}

Nishikawa, Hiroshi ^{[1
]}

机构：

[1] Osaka Univ, Joining & Welding Res Inst, 11-1 Mihogaoka, Osaka 5670047, Japan

[2] Osaka Univ, Grad Sch Engn, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan

来源：

SCRIPTA MATERIALIA | 2016年 / 120卷

关键词：

Sintering; Surface modification; Copper; Oxides; Oxidation-reduction bonding; NANOPARTICLES; COPPER; ELECTRONICS; OXIDATION; PASTE;

D O I：

10.1016/j.scriptamat.2016.04.018

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

An oxidation-reduction bonding (ORB) was applied to achieve Cu-Cu bonding with microscale Cu particle paste. During sintering at 300 degrees C, Cu2O nanoparticles were homogeneously formed on the surface of the microscale Cu particles through a thermal oxidation, and were subsequently reduced to Cu nanotextured surface in formic acid atmosphere. This in-situ surface modification significantly enhances the sinterability of the microscale Cu particles, leading to a well-sintered microstructure and a three times higher bonding strength than that of the bonding joints prepared with non-oxidation bonding (NOB). (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：80 / 84

页数：5

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