System integration and customized packaging of MOEMS

被引：0

作者：

Kopola, H ^{[1
]}

Blomberg, M ^{[1
]}

Karioja, P ^{[1
]}

Kautio, K ^{[1
]}

Rantala, JT ^{[1
]}

Rusanen, O ^{[1
]}

机构：

[1] VTT Elect, FIN-90570 Oulu, Finland

来源：

MOEMS 99: 3RD INTERNATIONAL CONFERENCE ON MICRO OPTO ELECTRO MECHANICAL SYSTEMS (OPTICAL MEMS), PROCEEDINGS | 1999年

关键词：

sol-gel; silicon micromachining; LTCC; hermetic sealing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the research and development work and results for designing and packaging different optoelectronic modules and microsystems for sensor and instrumentation applications at VTT Electronics. Sol-gel material fabrication techniques have been applied for micro-optic component, semiconductor glass and organic semiconductor manufacturing and packaging. Packaging realizations of a silicon micromachined microphone and IR-microspectrometer are discussed. Technologies for substrates, interconnections, sealing and protection are reviewed.

引用

页码：194 / 205

页数：12

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