System integration and customized packaging of MOEMS

被引：0
|
作者：
Kopola, H [1 ]
Blomberg, M [1 ]
Karioja, P [1 ]
Kautio, K [1 ]
Rantala, JT [1 ]
Rusanen, O [1 ]
机构：
[1] VTT Elect, FIN-90570 Oulu, Finland
来源：
MOEMS 99: 3RD INTERNATIONAL CONFERENCE ON MICRO OPTO ELECTRO MECHANICAL SYSTEMS (OPTICAL MEMS), PROCEEDINGS | 1999年
关键词：
sol-gel; silicon micromachining; LTCC; hermetic sealing;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the research and development work and results for designing and packaging different optoelectronic modules and microsystems for sensor and instrumentation applications at VTT Electronics. Sol-gel material fabrication techniques have been applied for micro-optic component, semiconductor glass and organic semiconductor manufacturing and packaging. Packaging realizations of a silicon micromachined microphone and IR-microspectrometer are discussed. Technologies for substrates, interconnections, sealing and protection are reviewed.
引用
收藏
页码：194 / 205
页数：12
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