System integration and customized packaging of MOEMS

被引：0

作者：

Kopola, H ^{[1
]}

Blomberg, M ^{[1
]}

Karioja, P ^{[1
]}

Kautio, K ^{[1
]}

Rantala, JT ^{[1
]}

Rusanen, O ^{[1
]}

机构：

[1] VTT Elect, FIN-90570 Oulu, Finland

来源：

MOEMS 99: 3RD INTERNATIONAL CONFERENCE ON MICRO OPTO ELECTRO MECHANICAL SYSTEMS (OPTICAL MEMS), PROCEEDINGS | 1999年

关键词：

sol-gel; silicon micromachining; LTCC; hermetic sealing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the research and development work and results for designing and packaging different optoelectronic modules and microsystems for sensor and instrumentation applications at VTT Electronics. Sol-gel material fabrication techniques have been applied for micro-optic component, semiconductor glass and organic semiconductor manufacturing and packaging. Packaging realizations of a silicon micromachined microphone and IR-microspectrometer are discussed. Technologies for substrates, interconnections, sealing and protection are reviewed.

引用

页码：194 / 205

页数：12

共 50 条

[11] Special issue on design, test, integration and packaging of EMS/MOEMS, 2013
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (09): : 1811 - 1811
[12] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (11): : 1759 - 1759
[13] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (06): : 773 - 773
[14] Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
Nouet, Pascal
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 361 - 361
[15] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
Bernard Courtois
Bernd Michel
Microsystem Technologies, 2012, 18 : 1759 - 1759
[16] Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
Courtois, Bernard
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2014, 78 (02) : 299 - 299
[17] Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
Bernard Courtois
Analog Integrated Circuits and Signal Processing, 2014, 78 : 299 - 299
[18] Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
Pascal Nouet
Bernd Michel
Microsystem Technologies, 2018, 24 : 361 - 361
[19] Special issue on design, test, integration and packaging of EMS/MOEMS, 2013
Bernard Courtois
Bernd Michel
Microsystem Technologies, 2015, 21 : 1811 - 1811
[20] MOEMS: packaging and testing
Wang, ZF
Cao, W
Lu, Z
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2005, 12 (1-2): : 52 - 58

← 1 2 3 4 5 →