Effects of gradient interlayer on residual stress and cracking in TiN thin films

被引：0

作者：

Qi, X ^{[1
]}

Li, GY ^{[1
]}

Shi, XR ^{[1
]}

Lü, X ^{[1
]}

Li, PX ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200030, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2000年 / 10卷 / 03期

关键词：

TiN thin film; residual stress; gradient interlayer;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The influence of a gradient interlayer on the residual stress and cracking in TiN thin films was studied as a function of the thickness of gradient interlayer. Both X-ray in-situ tensile testing and grazing method were used to measure the residual stress in thin films. In TiN films, there exists a residual stress of 10 GPa, which can be remarkably decreased by a gradient interlayer between film and substrate. The cracking behavior of films after tension shows that the crack of film/substrate system begins at interface between film and substrate.

引用

页码：294 / 297

页数：4

共 50 条

[1] Effects of gradient interlayer on residual stress and cracking in TiN thin films
QI Xuan(漆王睿 )
TransactionsofNonferrousMetalsSocietyofChina, 2000, (03) : 294 - 297
[2] Effects of gradient interlayer on residual stress and cracking in TiN thin films
Qi, Xuan
Li, Ge-Yang
Shi, Xiao-Rong
Lu, Xia
Li, Peng-Xing
Transactions of Nonferrous Metals Society of China (English Edition), 2000, 10 (03): : 294 - 297
[3] Effect of Ti interlayer on the residual stress and texture development of TiN thin films
Huang, JH
Ma, CH
Chen, H
SURFACE & COATINGS TECHNOLOGY, 2006, 200 (20-21): : 5937 - 5945
[4] Effect of Ti interlayer on the residual stress and texture development of TiN thin films deposited by unbalanced magnetron sputtering
Huang, Jia-Hong
Ma, Cheng-Hsin
Chen, Haydn
SURFACE & COATINGS TECHNOLOGY, 2006, 201 (06): : 3199 - 3204
[5] Residual stress gradient of Cr and CrN thin films
Arias, D. F.
Gomez, A.
Souza, R. M.
Velez, J. M.
MATERIALS CHEMISTRY AND PHYSICS, 2018, 204 : 269 - 276
[6] Multiple cracking of thin films due to residual stress combined with bending stress
Fu, Y.
Zhang, X. C.
Xuan, F. Z.
Tu, S. T.
Wang, Z. D.
COMPUTATIONAL MATERIALS SCIENCE, 2013, 73 : 113 - 119
[7] Effects of annealing on residual stress and strain gradient of doped polycrystalline SiC thin films
Roper, Christopher S.
Radmilovic, Velimir
Howe, Roger T.
Maboudian, Roya
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2008, 11 (04) : D35 - D37
[8] Residual stress effects in ferroelectric thin films
Berfield, TA
Sottos, NR
Ong, RJ
Payne, DA
FERROELECTRIC THIN FILMS XII, 2004, 784 : 29 - 34
[9] CRACKING OF THIN BONDED FILMS IN RESIDUAL TENSION
BEUTH, JL
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1992, 29 (13) : 1657 - 1675
[10] Discontinuous cracking of TiN films on a steel substrate induced by an adhesive interlayer
Guo, Tao
Pang, Xiaolu
He, Jianying
Qiao, Lijie
PHILOSOPHICAL MAGAZINE LETTERS, 2019, 99 (06) : 199 - 207

← 1 2 3 4 5 →