Effects of gradient interlayer on residual stress and cracking in TiN thin films

被引:0
|
作者
Qi, X [1 ]
Li, GY [1 ]
Shi, XR [1 ]
Lü, X [1 ]
Li, PX [1 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200030, Peoples R China
关键词
TiN thin film; residual stress; gradient interlayer;
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
The influence of a gradient interlayer on the residual stress and cracking in TiN thin films was studied as a function of the thickness of gradient interlayer. Both X-ray in-situ tensile testing and grazing method were used to measure the residual stress in thin films. In TiN films, there exists a residual stress of 10 GPa, which can be remarkably decreased by a gradient interlayer between film and substrate. The cracking behavior of films after tension shows that the crack of film/substrate system begins at interface between film and substrate.
引用
收藏
页码:294 / 297
页数:4
相关论文
共 50 条
  • [21] X-ray measurements of residual stress distribution in TiN thin films with fiber texture
    Tanaka, K
    Akiniwa, Y
    Kawai, M
    Ito, T
    RESIDUAL STRESSES VII, PROCEEDINGS, 2005, 490-491 : 678 - 683
  • [22] Influence of interfacial neighborhood on residual stress due to deposition of TiN thin films made by PVD
    Hirose, H
    Suzuki, S
    Gotoh, M
    Sasaki, T
    RESIDUAL STRESSES VII, PROCEEDINGS, 2005, 490-491 : 601 - 606
  • [23] Residual stress effects in doped barium strontium titanate thin films
    Nothwang, WD
    Cole, MW
    Hubbard, C
    Ngo, E
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (03) : F37 - F43
  • [24] Residual Stress and Surface Energy of Sputtered TiN Films
    Xiaolu Pang
    Liqiang Zhang
    Huisheng Yang
    Kewei Gao
    Alex A. Volinsky
    Journal of Materials Engineering and Performance, 2015, 24 : 1185 - 1191
  • [25] Residual Stress and Surface Energy of Sputtered TiN Films
    Pang, Xiaolu
    Zhang, Liqiang
    Yang, Huisheng
    Gao, Kewei
    Volinsky, Alex A.
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2015, 24 (03) : 1185 - 1191
  • [26] Residual stress and its thermal relaxation in TiN films
    Matsue, T
    Hanabusa, T
    Ikeuchi, Y
    THIN SOLID FILMS, 1996, 281 (1-2) : 344 - 347
  • [27] Microstructure, residual stress, and fracture of sputtered TiN films
    Zhang, Liqiang
    Yang, Huisheng
    Pang, Xiaolu
    Gao, Kewei
    Volinsky, Alex A.
    SURFACE & COATINGS TECHNOLOGY, 2013, 224 : 120 - 125
  • [28] Residual stresses gradient determination in Cu thin films
    Peng, Jun
    Ji, Vincent
    Zhang, Jian-Min
    Seiler, Wilfrid
    RESIDUAL STRESSES VII, 2006, 524-525 : 595 - 600
  • [29] Stress anisotropy and structure of TiN thin films
    Conradi, T
    Hubenthal, F
    Roll, K
    Stobiecki, T
    Thoma, K
    Berg, G
    Broszeit, E
    Bauer, S
    Bock, W
    Scheib, M
    Wiescher, D
    Oechsner, H
    MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 1998, 29 (09) : 476 - 483
  • [30] Stress and texture in HIPIMS TiN thin films
    Machunze, R.
    Ehiasarian, A. P.
    Tichelaar, F. D.
    Janssen, G. C. A. M.
    THIN SOLID FILMS, 2009, 518 (05) : 1561 - 1565