The Dependence of the Performance of Strained NMOSFETs on Channel Width

被引:5
|
作者
Yeh, Lingyen [1 ,2 ]
Liao, Ming Han [2 ]
Chen, Chun Heng [1 ]
Wu, Jun [2 ,3 ]
Lee, Joseph Ya-Min [1 ]
Liu, Chee Wee [4 ,5 ]
Lee, T. L. [2 ]
Liang, M. S. [2 ]
机构
[1] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 300, Taiwan
[2] Taiwan Semicond Mfg Co, Hsinchu 300, Taiwan
[3] Natl Chiao Tung Univ, Grad Inst Mat Sci & Engn, Hsinchu 300, Taiwan
[4] Natl Taiwan Univ, Dept Elect Engn, Taipei 106, Taiwan
[5] Natl Nano Device Labs, Hsinchu 300, Taiwan
关键词
Contact etch stop layer (CESL); high-stress silicon nitride; MOSFET; strained silicon; MOBILITY;
D O I
10.1109/TED.2009.2030542
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The dependence of the performance of strained NMOSFETs on channel width was investigated. When the channel width was varied, the stress in the channel varied accordingly. This changed the electron effective mass and, consequently, the ON-state current I-on. By shrinking the channel width of a strained NMOSFET from 1 to 0.1 mu m and by keeping the channel length at 55 nm, the ON-state drain current per unit channel width was enhanced by 22%. The gate leakage current was also affected by the stress in the channel, which can be explained by the increase in hole barrier height at the Si/SiO2 interface. Furthermore, when the film stress was increased by 1 GPa, the gate leakage current density J(g) of a strained NMOSFET with a channel width of 0.1 mu m and a length of 55 nm under a negative bias -3 V was reduced by 63%.
引用
收藏
页码:2848 / 2852
页数:5
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